SN EN 61190-1-2:2014
Current
Current
The latest, up-to-date edition.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
Available format(s)
Hardcopy
Published date
01-05-2014
Publisher
Committee |
CES/TK 91
|
DocumentType |
Standard
|
Pages |
0
|
PublisherName |
Swiss Standards
|
Status |
Current
|
Standards | Relationship |
EN 61190-1-2:2014 | Identical |
IEC 61190-1-2:2014 | Identical |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.