JEDEC JESD51-11:2001
Current
Current
The latest, up-to-date edition.
Test Boards for Through-Hole AreaArray Leaded Package ThermalMeasurements
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
06-01-2001
Publisher
This specification covers through-hole area array leaded packages intended to be mounted on a PCB. Itdoes not cover area array packages that require sockets.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.