BS CECC 200025:1998
Current
The latest, up-to-date edition.
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Hardcopy , PDF
English
08-15-1998
Introduction
1 General requirements
1.1 Scope
1.2 Definitions and abbreviations
1.3 Related documents
1.4 Units, symbols and terminology
1.5 Quality system
1.6 Rework and repair of printed board assemblies
2 Quality requirements of the process sequence
2.1 Process description
2.2 Quality factors
2.3 Process specifications
2.4 Demonstration, verification and validation
programmes
2.5 Maintenance programmes
2.6 Electrical, mechanical and environmental test methods
2.7 Identification and traceability
3 Specialist Assembly Facility documentation requirements
3.1 Process Manual
3.2 Process Approval reports
3.3 Abstract of description of Process Approval
4 Audits
4.1 General
4.2 Audit preparation plans
4.3 Audit checklists
4.4 Internal audits
4.5 External audits
5 Corrective actions and failure analysis
5.1 Corrective actions
5.2 Failure analysis
6 Interface between Assembly Facility and Customer
6.1 General
6.2 Customer enquiries, orders and contracts
6.3 Guidance to Customer Document (GCD)
6.4 Customer Detail Specifications
6.5 Post-supply liaison
7 Training
7.1 General
7.2 Training procedures
8 Notification of modifications to capability
Annexes
Annex A Definitions
Annex B Form and content of process specifications
Annex C Form and content of Process Manuals
Annex D Format of first page of Process Approval report
Annex E Example abstract of description of
Process Approval
Annex F Audit check list (technical)
Annex G Abbreviations
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