IPC FC 231 : C1992 AMD 1 1995

Superseded

View Superseded by

FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING

Superseded date

05-01-2002

Published date

01-12-2013

Publisher

Institute of Printed Circuits

NO CONTENTS SECTION

Establishes the requirements for flexible base dielectric materials to be used in the fabrication of flexible printed wiring and flexible flat cable. The following topics are covered: base dielectrics; type of reinforcement; method of reinforcement and product classification.

DevelopmentNote	D99 (PROPOSAL) is an official representative proposal (draft only). (07/2002)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 4202 : A
Supersedes	IPC FC FLX : 1988

IPC A 31 : LATEST	FLEXIBLE RAW MATERIAL TEST PATTERN - FILM FORMAT
MIL-STD-2118 Base Document:1984	FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
IEC PAS 62293:2001	Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
IEC PAS 62249:2001	Qualification and performance specification for flexible printed boards

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
MIL-STD-45662 Revision A:1988	CALIBRATION SYSTEMS REQUIREMENTS
IPC TM 650 : 0	TEST METHODS MANUAL
IPC PC 1990 : 1990	GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL
MIL-STD-414 Base Document:1957	SAMPLING PROCEDURE AND TABLE FOR INSPECTION BY VARIABLES FOR PERCENT DEFECTIVE
IPC FC 232 : C1994 AMD 1 1995	ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS
MIL-STD-202 Revision H:2015	ELECTRONIC AND ELECTRICAL COMPONENT PARTS
IPC FC 241 : C1992 AMD 1 1995	FLEXIBLE METAL CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING
MIL-STD-105 Revision E:1989	SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES
ASTM D 374 : 1999	Standard Test Methods for Thickness of Solid Electrical Insulation