STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX

Published date

01-01-2015

Publisher

National Aeronautics and Space Administration

DOCUMENT HISTORY LOG
FOREWORD
1. SCOPE
2. APPLICABLE DOCUMENTS
3. ACRONYMS AND DEFINITIONS
4. REQUIREMENTS
5. GUIDANCE
APPENDIX A - Examples of Percent Voiding In Chip Package
Solder Joints
APPENDIX B - Water Soluble Flux Initial Qualification
Reports Checklist

Sets up the requirements applicable to soldering processes for Printed Wiring Assemblies (PWAs) that use Water Soluble Flux (WSF).

DevelopmentNote	Expiration Date: 03-09-2020. (09/2015)
DocumentType	Standard
PublisherName	National Aeronautics and Space Administration
Status	Current

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NASA GSFC STD 8002 : 2015

STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX

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Abstract

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