PD IEC/TS 62647-2:2012
Current
The latest, up-to-date edition.
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin
Hardcopy , PDF
English
01-31-2013
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical requirement
Annex A (informative) - Guidance on control levels,
risk assessment, and mitigation evaluation
Annex B (informative) - Technical guide on detection
methods, mitigation methods, and methods for
limiting impact of tin
Annex C (informative) - Tin whisker inspection
Annex D (informative) - Analysis and risk assessment
guidance
Annex E (informative) - Whiskers growing from solder
joint fillets and bulk solder
Bibliography
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