Name: ASTM F 1995 : 2013 : REDLINE
Brand: ASTM
Price: 110.51 AUD
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Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch

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PDF

Language(s)

English

Published date

01-05-2013

Publisher

American Society for Testing and Materials

CONTAINED IN VOL. 10.04, 2015 Defines the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit.

1.1This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit.

1.2This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or both. In general, this test method should be used prior to encapsulant. This test may also be used to demonstrate the Shear Force with encapsulation.

1.3The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.4This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Committee	F 01
DocumentType	Redline
Pages	3
PublisherName	American Society for Testing and Materials
Status	Current

ASTM F 2114 : 2002

Standard Guide for ASTM Standard Test Methods, Standard Practices, and Typical Values of a Membrane Switch (Withdrawn 2009)

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ASTM F 1995 : 2013 : REDLINE

Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch

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