Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-09-1997

Publisher

British Standards Institution

INTRODUCTION
1 Scope
2 Terms and definitions
3 Description of tape automated bonding (TAB)
4 Dimensional requirements
    4.1 Film format
    4.2 Alignment holes
    4.3 Body size
    4.4 Test pad patterns
    4.5 Outer lead patterns
    4.6 Maximum lead count
5 Variation codes
6 Requirements for inner and outer lead bonding (LIB
    and OLB)
Figures
Tables
Notes to figures and tables
Annexes
A Summary of recommended TAB package configurations
    (super format)
B Summary of recommended TAB package configurations
    (wide format)
C Outer lead numbering
D Test pad numbering

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

Committee	EH/3
DevelopmentNote	Also numbered as IEC 60191-5 Supersedes 93/216730 DC and BS 3934-5(1992) (07/2005)
DocumentType	Standard
Pages	38
PublisherName	British Standards Institution
Status	Current
Supersedes	BS 3934-5:1992