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BS 5909:1980

Current

Current

The latest, up-to-date edition.

Method for scale adhesion test for oxygen-free copper

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-04-1980

$325.41
Including GST where applicable

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.

Committee
NFE/34
DevelopmentNote
Also numbered as ISO 4746 (09/2005)
DocumentType
Standard
Pages
6
PublisherName
British Standards Institution
Status
Current

This International Standard specifies a procedure for the scale adhesion testing of oxygen-free high-conductivity copper.

Standards Relationship
UNE-EN 13848-3:2010 Identical

BS 6017:1981 Specification for copper refinery shapes

$325.41
Including GST where applicable