Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-06-1998

Publisher

British Standards Institution

1 GENERAL
    1.1 Scope
    1.2 Object
2 CAPABILITY QUALIFYING COMPONENT
    2.1 Materials
    2.2 Surface finishes
          2.2.1 Metallic finishes
                  2.2.1.1 Accelerated ageing
          2.2.2 Organic finishes
    2.3 Variant designation
3 CAPABILITY APPROVAL
    3.1 Range of capability approval
    3.2 QPL information
4 CAPABILITY TEST PROGRAMME
    4.1 Capability demonstration
          4.1.1 Other metallic surface finishes
          4.1.2 Organic surface finishes
          4.1.3 External bonded heatsinks
          4.1.4 Demonstration of impedance control
5 ADDITIONAL CAPABILITY
6 TRACEABILITY
Tables
I Capability approval test schedule
IIa Additional metallic conductor finishes
IIb Additional contact finishes
III Permanent organic finishes
IV Bonded heatsinks
Annex A Suitable test pattern for marking inks
Annex B Suitable test pattern for solder masks
Annex C Suitable test pattern for bonded heatsinks
Annex D Edge connector imperfections
Annex E CTP subdivision for thermal shock
Annex F Circumferential defects in plated-through holes
Annex G Determination of characteristic impedance by TDR

Concerned with rigid multilayer printed boards, made with materials and surface finishes as defined in clause 2. Defines the Capability Qualifying Component (CQC), its characteristics for testing, the test procedure and conditions for application, together with requirements for fulfilling for testing of basic and extended capability.

Committee	EPL/501
DevelopmentNote	Supersedes BS EN 123300-800. To be read in conjunction with BS EN 123000 and BS EN 123300. (01/2006)
DocumentType	Standard
Pages	34
PublisherName	British Standards Institution
Status	Current
Supersedes	BS EN 123300-800:1992

Standards	Relationship
CECC 23300-801 : 1998	Identical

DEFSTAN 08-107/3(2013) : 2013

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BS CECC 23300-801:1998

Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

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