BS EN 60191-4:2014+A1:2018
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages
Hardcopy , PDF
English
30-05-2018
This part of IEC 60191 specifies a method for the designation of package outlines and for the lassification of forms of package outlines for semiconductor devices and a systematic method or generating universal descriptive designators for semiconductor device packages.
| Committee |
EPL/47
|
| DocumentType |
Amendment
|
| Pages |
42
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.
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