BS EN 60191-6-13:2016
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Hardcopy , PDF
English
31-12-2016
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 05/30132033 DC. (01/2008) Supersedes 13/30284025 DC. (12/2016)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.
| Standards | Relationship |
| EN 60191-6-13:2016 | Identical |
| DIN EN 60191-6-13:2013-07 (Draft) | Identical |
| NF EN 60191-6-13 : 2017 | Identical |
| I.S. EN 60191-6-13:2016 | Identical |
| IEC 60191-6-13:2016 | Identical |
| UNE-EN 60191-6-13:2016 | Equivalent |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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