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BS EN 60191-6-20:2010

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-12-2010

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Defines methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

This part of IEC 60191 specifies methods to measure package dimensions of small outline Jlead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

Committee
EPL/47
DevelopmentNote
Supersedes 08/30190026 DC. (12/2010)
DocumentType
Standard
Pages
16
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
EN 60191-6-20:2010 Identical
IEC 60191-6-20:2010 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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