BS EN 60749-16:2003
Current
The latest, up-to-date edition.
Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
Hardcopy , PDF
English
24-06-2004
Foreword
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance
8 Detail specification
9 Summary
Detects the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
| Committee |
EPL/47
|
| DevelopmentNote |
Partially supersedes BS EN 60749 Supersedes 00/203281 DC (07/2003)
|
| DocumentType |
Standard
|
| Pages |
10
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
| Standards | Relationship |
| DIN EN 60749-16:2003-09 | Identical |
| NBN EN 60749-16 : 2004 | Identical |
| I.S. EN 60749-16:2003 | Identical |
| IEC 60749-16:2003 | Identical |
| EN 60749-16:2003 | Identical |
| NF EN 60749-16 : 2003 | Identical |
| UNE-EN 60749-16:2003 | Identical |
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