BS EN 60749-21:2005
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Semiconductor devices. Mechanical and climatic test methods Solderability
Hardcopy , PDF
English
05-12-2005
01-01-2011
| Committee |
EPL/47
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for \'dip and look\' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
| Standards | Relationship |
| IEC 60749-21:2004 | Identical |
| IEC 60092-306:2009 | Identical |
| I.S. EN 60749-21:2005 | Equivalent |
| EN 60749-21:2005 | Equivalent |
| UNE-EN 60749-21:2005 | Equivalent |
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