BS EN 61189-5:2006

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
   3.1 Accuracy
   3.2 Precision
   3.3 Resolution
   3.4 Report
   3.5 Student's t distribution
   3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
   5.1 Test 5P01: Test-board design guideline
   5.2 Test 5P02: Standard mounting process
         for CSP/BGA packages
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
   8.1 Test 5C01: Corrosion, flux
9 M: Mechanical test methods
   9.1 Test 5M01: Peel test method for test-board land
10 E: Electrical test methods
   10.1 Test 5E01: Changes of the surface
         insulation resistance caused by fluxes
   10.2 Test 5E02: Surface insulation resistance,
         assemblies
11 N: Environmental test methods
   11.1 Test 5N01: Reflow solderability test for
         soldering joint
   11.2 Test 5N02: Resistance to reflow solderability
         of test board
   11.3 Test 5N03: Solderability test for test board land
12 X Miscellaneous test methods
   12.1 Test 5X01: Liquid flux activity, wetting
         balance method
   12.2 Test 5X02: Paste flux viscosity - T-Bar
         spindle method
   12.3 Test 5X03: Spread test, liquid or extracted
         solder flux, solder paste and extracted
         cored wires or preforms
   12.4 Test 5X04: Solder paste viscosity - T-Bar
         spin spindle method (applicable to 300 Pa.s
         to 1600 Pa.s)
   12.5 Test 5X05: Solder paste viscosity - T-Bar
         spindle method (applicable to 300 Pa.s)
   12.6 Test 5X06: Solder paste viscosity - Spiral
         pump method (applicable to 300 Pa.s
         to 1600 Pa.s)
   12.7 Test 5X07: Solder paste viscosity - Spiral
         pump method (applicable to Pa.s)
   12.8 Test 5X08: Solder paste - Slump test
   12.9 Test 5X09: Solder paste - Solder ball test
   12.10 Test 5X10: Solder paste - Tack test
   12.11 Test 5X11: Solder paste - Wetting test
   12.12 Test 5X12: Flux residues - Tackiness
         after drying
   12.13 Test 5X13: Spitting of flux-cored wire
         solder
   12.14 Test 5X14: Solder pool test
Bibliography
Annex ZA (normative) - Normative references to
                       international publications with
                       their corresponding European
                       publications

Describes test methods representing methodologies and procedures that can be applied to test printed board assemblies.

IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.