BS EN 62047-18:2013
Current
The latest, up-to-date edition.
Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials
Hardcopy , PDF
English
31-10-2013
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method
6 Test report
Annex A (informative) - Precautions for the test
piece/substrate interface
Annex B (informative) - Precautions necessary for the force
displacement relationship
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
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