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BS EN 62137-1-2:2007

Current

Current

The latest, up-to-date edition.

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-10-2007

$380.41
Including GST where applicable
Summarise this standard

1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
   5.1 Shear test equipment
   5.2 Pushing tool
   5.3 Optical microscope
   5.4 Scanning electron microscope (SEM)
   5.5 Reflow soldering oven
   5.6 Test substrate
   5.7 Solder alloy
   5.8 Solder paste
6 Mounting method
7 Test conditions
   7.1 Test: Rapid change of temperature
   7.2 Shear strength test
8 Test procedure
   8.1 Test sequence
   8.2 Pre-conditioning
   8.3 Initial shear strength
   8.4 Rapid change of temperature
   8.5 Recovery
   8.6 Intermediate/final shear strength
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) - Shear strength test - Details
Bibliography
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications

Applies to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads.

Committee
EPL/501
DevelopmentNote
Supersedes 05/30133599 DC. (10/2007)
DocumentType
Standard
Pages
20
PublisherName
British Standards Institution
Status
Current
Supersedes

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Standards Relationship
EN 61340-3-1:2002 Identical
NBN EN 62137-1-2 : 2007 Identical
EN 62137-1-2:2007 Identical
NF EN 62137-1-2 : 2014 Identical
IEC 62137-1-2:2007 Identical
DIN EN 62137-1-2:2008-02 Identical
I.S. EN 62137-1-2:2007 Identical
UNE-EN 62137-1-2:2007 Equivalent

$380.41
Including GST where applicable