Semiconductor die products Requirements for information concerning thermal simulation

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-11-2006

Publisher

British Standards Institution

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
  5.1 Requirements for bare die with or without added
      connection structures
  5.2 Requirements for minimally-packaged die
  5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2

Committee	EPL/47
DevelopmentNote	Supersedes BS PD ES 59008-4.3 & 05/30139923 DC. (11/2006)
DocumentType	Standard
Pages	14
PublisherName	British Standards Institution
Status	Current
Supersedes	05/30139923 DC : DRAFT OCT 2005 BS PD ES 59008-4.3 : 2000 PD ES 59008-4-3:2000

Standards	Relationship
IEC 62258-6:2006	Identical
NBN EN 62258-6 : 2007	Identical
EN 62258-6 : 2006	Identical
DIN EN 62258-6:2007-02	Identical
I.S. EN 62258-6:2006	Identical
NF EN 62258-6 : 2006	Identical

EN 62258-2:2011	SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
IEC 62258-1:2009	Semiconductor die products - Part 1: Procurement and use
EN 62258-1:2010	Semiconductor die products - Part 1: Procurement and use
IEC 62258-2:2011	Semiconductor die products - Part 2: Exchange data formats

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BS EN 62258-6:2006

Semiconductor die products Requirements for information concerning thermal simulation

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory