BS IEC 63011-1:2018
Current
The latest, up-to-date edition.
Integrated circuits. Three dimensional integrated circuits Terminology
Hardcopy , PDF
English
24-01-2019
| Committee |
EPL/47
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
IEC63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
| Standards | Relationship |
| IEC 63011-1:2018 | Identical |
| IEC 61362:2012 | Identical |
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