CEI CLC/TR 62258-7 : 2009
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
Hardcopy , PDF
English
01-01-2009
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 General
5 Data exchange
Annex A (normative) - XML schema
Annex B (informative) - XML example
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Aims to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1032. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| CLC/TR 62258-7:2007 | Identical |
| IEC TR 62258-7:2007 | Identical |
| EN 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| IEC 62258-5:2006 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| EN 62258-6:2006 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation |
| EN 62258-5:2006 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
| IEC 62258-6:2006 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation |
| CLC/TR 62258-4:2013 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
| IEC TR 62258-4:2012 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
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