CEI EN 60068-2-69 : 2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
Hardcopy , PDF
English - Italian
01-01-2008
17-07-2025
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the method
5 Description of the test apparatus
6 Preparation of specimens
7 Materials
8 Procedure
9 Presentation of results
10 Information to be given in the relevant specification
Annex A (normative) - Equipment specification
Annex B (informative) - Use of the wetting balance
for SMD solderability testing
Annex C (normative) - Test methods for SMD components
sizes 0603M (0201) or Smaller
Annex D (informative) - Evaluation criteria - Guidance
Annex E (informative) - Method of calculating the maximum
theoretical force and integrated value of the area of
the wetting curve for leaded non-SMD
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-49. (04/2008) 2ED 2008 Edition is valid until 11-04-2020; and only available in combined English/Italian. Supersedes CEI EN 60068-2-54 which remains current and will be withdrawn on 11-04-2020. (12/2017)
|
| DocumentType |
Standard
|
| Pages |
52
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60068-2-69:2017 | Identical |