CEI EN 60191-6-21 : 2011
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
Hardcopy , PDF
English
01-11-2011
FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. Measuring methods
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-79. (12/2011)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-21:2010 | Identical |
| IEC 60191-6-21:2010 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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