CEI EN 60191-6-4 : 2004
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
Hardcopy , PDF
English
01-02-2004
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
5 Measuring method
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Provides the requirements for the measuring methods of ball grid array (BGA) dimensions.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1004. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-4:2003 | Identical |
| EN 60191-6-4:2003 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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