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CEI EN 60352-5 : 2013

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2013

Superseded date

16-10-2021

Superseded by

CEI EN IEC 60352-5:2021

$177.11
Including GST where applicable

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
5 Tests
Annex A (informative) - Practical
        guidance
Bibliography

Pertains to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques.

Committee
CT 48
DevelopmentNote
Classificazione CEI 48-26. (09/2001)
DocumentType
Standard
Pages
40
PublisherName
Comitato Elettrotecnico Italiano
Status
Superseded
SupersededBy

Standards Relationship
IEC 60352-5:2012 Identical
EN 60352-5:2012/AC:2014 Identical

IEC GUIDE 109:2012 Environmental aspects - Inclusion in electrotechnical product standards
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
EN 60512-1-100:2012 Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
IEC 60352-1:1997 Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance
IEC 60512-1-100:2012 Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 60352-1:1997 Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance
EN 62326-4:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
IEC 60050-581:2008 International Electrotechnical Vocabulary (IEV) - Part 581: Electromechanical components for electronic equipment

$177.11
Including GST where applicable