CEI EN 60749-16 : 2005
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)
Hardcopy , PDF
English
01-01-2005
FOREWORD
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance (for guidance)
8 Detail specification
9 Summary
Bibliography
Describes to detect the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-43. (11/2005)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-16:2003 | Identical |
| EN 60749-16:2003 | Identical |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
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