CEI EN 60749-22 : 2004
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH
Hardcopy , PDF
English
01-01-2004
Foreword
Introduction
1 Scope and object
2 Methods A and B
3 Method C
4 Method D
5 Methods E and F
6 Method G: Wire ball
shear test
7 Information to be given
in the relevant specification
Annex A (normative) - Guidance
Defines to semiconductor devices (discrete devices and integrated circuits).
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-26 (04/2004) Supersedes CEI EN 60749. (05/2008)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60749-22:2002 | Identical |
| EN 60749-22:2003 | Identical |
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