CEI EN 61240 : 2013
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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PIEZOELECTRIC DEVICES - PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION - GENERAL RULES
Hardcopy , PDF
English
01-01-2013
30-07-2025
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Classification of SMD
4 Title of the outline drawing
5 Composition of the outline drawing
6 Requirements for terminal leads
7 Requirements for the terminal land area
8 Connections of terminal leads
9 Descriptive notes
Annex A (informative) - Miniaturized leadless ceramic enclosures
of piezoelectric devices (SMD) for frequency control
and selection
Annex B (informative) - Example of terminal connections for
surface-mounted piezoelectric devices (SMD) for frequency
control and selection
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Describes general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this document as SMD) in order to ensure mechanical inter-changeability of all outline drawings of the SMDs for frequency control and selection.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 309-37. (07/2013) 2ED 2013 Edition is valid until 28-11-2019. (06/2017)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| EN 61240:2017 | Identical |
| IEC 61240:2016 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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