CEI EN 62137-3 : 2012
Current
The latest, up-to-date edition.
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
Hardcopy , PDF
English - Italian
01-01-2012
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Procedure of selecting the applicable
test method
6 Common subjects in each test method
7 Evaluation test method
Annex A (informative) - Condition of rapid
temperature change
Annex B (informative) - Electrical continuity
test for solder joint
Annex C (informative) - Torque shear strength
test
Annex D (informative) - Monotonic bending
strength test
Annex E (informative) - Cyclic steel ball drop
strength test
Annex F (informative) - Pull strength test
Annex G (informative) - Creep strength test
Annex H (informative) - Evaluation method for
the fillet lifting phenomenon of a lead
insertion type device solder joint
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-67. (09/2012)
|
| DocumentType |
Standard
|
| Pages |
90
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62137-3:2011 | Identical |
| EN 62137-3:2012 | Identical |
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