CEI EN IEC 60749-10:2022
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly
Hardcopy , PDF
English
01-12-2022
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment.
| Committee |
CT 309
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-4493-7
|
| Pages |
20
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 60749-10:2022 | Identical |
| IEC 60749-10:2022 | Identical |
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