CEI EN IEC 60749-21:2026
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods –Part 21: Solderability
Hardcopy , PDF
English
01-03-2026
This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
| Committee |
TC 47
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8327-0902-3
|
| Pages |
30
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60749-21:2025 | Identical |
| EN IEC 60749-21:2026 | Identical |
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