CEI EN IEC 60749-22-1:2026
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods –Part 22-1: Bond strength - Wire bond pull test methods
Hardcopy , PDF
English
01-02-2026
This part of IEC 60749 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be performed on unencapsulated or decapsulated devices.
| DocumentType |
Test Method
|
| Pages |
68
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-22-1:2025 | Identical |
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