CEI EN IEC 60749-22-2:2026
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods –Part 22-2: Bond strength - Wire bond shear test methods
Hardcopy , PDF
English
01-02-2026
This Standard defines the destructive method for determining the strength of ball joints made by thermosonic joint on the connection surfaces of the chip or container.
| Committee |
CT 309
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8327-0882-
|
| Pages |
44
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 60749-22-2:2026 | Identical |
| IEC 60749-22-2:2025 | Identical |
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