CEI EN IEC 61189-2-804:2024
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Hardcopy , PDF
English
01-01-2024
This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA).
| Committee |
CT 309
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-7422-4
|
| Pages |
18
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 61189-2-804:2023 | Identical |
| IEC 61189-2-804:2023 | Identical |
| TM-650-MDP:2020 | IPC Test Method Development Packet |
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