DIN EN 60191-6-20:2011-03
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2011
$170.78
Including GST where applicable
| DevelopmentNote |
Supersedes DIN IEC 60191-6-20. (03/2011)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60191-6-20:2010 | Identical |
| IEC 60191-6-20:2010 | Identical |
Summarise
$170.78
Including GST where applicable
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.