DS/EN IEC 61188-6-3:2025
Current
Current
The latest, up-to-date edition.
Circuit boards and circuit board assemblies – Design and use – Part 6-3: Land pattern design – Description of land pattern for through hole components (THT)
Published date
04-02-2025
Publisher
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Summarise this standard
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IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.
| Committee |
DS/V-001
|
| DocumentType |
Standard
|
| PublisherName |
Danish Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61188-6-3:2024 | Identical |
| EN IEC 61188-6-3:2025 | Identical |
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