DS EN IEC 61837-2:2018
Current
The latest, up-to-date edition.
Surface mounted piezoelectric components for frequency control and frequency selection - Standard configuration and terminal connections - Part 2: Ceramic encapsulations
20-07-2018
| Committee |
DS/V-001
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| DevelopmentNote |
NEW CHILD AMD 1 2020 IS NOW ADDED
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| DocumentType |
Standard
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| ProductNote |
NEW CHILD AMD 1 2020 IS NOW ADDED
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| PublisherName |
Danish Standards
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| Status |
Current
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IEC 61837-2: 2018 (E) deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240: 2016. This edition includes the following significant technical changes with respect to the previous edition: a. Revision of the figures to match the notation of the drawings of IEC 61240: 2016; b. Addition of 7 enclosures as follows: DCC-6 / 5032A, DCC-6 / 3225A, DCC-4 / 3215C, DCC-6 / 2016A, DCC-2 / 2012C, DCC-2 / 1610C, DCC-4 / 1210C . As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
| Standards | Relationship |
| EN IEC 61837-2:2018 | Identical |