EN 60191-4:2014/A1:2018
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 4: CODING SYSTEM AND CLASSIFICATION INTO FORMS OF PACKAGE OUTLINES FOR SEMICONDUCTOR DEVICE PACKAGES (IEC 60191-4:2013/A1:2018)
18-05-2018
FOREWORD
1 Scope
2 Coding system of package outlines for semiconductor
devices
3 Classification into forms of package outlines for
semiconductor devices
4 Coding systems for semiconductor-device packages
5 Coding system of package-outline styles
Annex A (informative) - Examples of descriptive coding system
application
Annex B (informative) - Derivation and application of the
descriptive coding system - Common package names
Annex C (informative) - Terminology of
semiconductor package outlines
Defines a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
| Committee |
SR 47D
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60191-4 : 2014 | Identical |
| I.S. EN 60191-4:2014 | Identical |
| BS EN 60191-4 : 2014 | Identical |
| NBN EN 60191-4 : 2014 | Identical |
| IEC 60191-4:2013/AMD1:2018 | Identical |
| PN EN 60191-4 : 2014 | Identical |
| OVE EN 60191-4:2019 | Identical |
| NEN EN IEC 60191-4 : 2014 | Identical |
| CEI EN 60191-4/A1:2018 | Identical |
| CEI EN 60191-4 : 2015 | Identical |
| DIN EN 60191-4:2014-10 | Identical |
| IEC 60191-4:2013 | Identical |