EN 60749-8:2003
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
20-06-2003
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 General terms
3.1 Units of pressure
3.2 Standard leak rate
3.3 Measured leak rate
3.4 Equivalent standard leak rate
4 Bomb pressure test
5 Fine leak detection: radioactive krypton method
5.1 Object
5.2 General description
5.3 Personnel precautions
5.4 Procedure
5.5 Specified conditions
5.6 Gross leak detection
6 Fine leak detection: tracer gas (helium) method
with mass spectrometer
6.1 General
6.2 Method 1: specimens not filled with helium
during manufacture - Fixed method
6.3 Method 2: specimens not filled with helium
during manufacture - Flexible method
6.4 Method 3: specimens filled with helium
during manufacture
6.5 Gross leak detection
7 Gross leaks, perfluorocarbon - bubble detection
method
7.1 Object
7.2 General description
7.3 Test apparatus
7.4 Test method
7.5 Reject criterion
8 Gross leak - Perfluorocarbon - bubble detection
method
9 Test condition E, weight-gain gross-leak detection
9.1 Object
9.2 Equipment
9.3 Procedure
9.4 Failure criteria
10 Penetrant dye gross leak detection
11 Gross leak re-test
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NEN EN IEC 60749-8 : 2003 | Identical |
| IEC 60749-8:2002 | Identical |
| PN EN 60749-8 : 2005 | Identical |
| NBN EN 60749-8 : 2004 | Identical |
| SN EN 60749-8 : 2003 | Identical |
| I.S. EN 60749-8:2003 | Identical |
| DIN EN 60749-8:2003-12 | Identical |
| NF EN 60749-8 : 2003 | Identical |
| CEI EN 60749-8 : 2004 | Identical |
| UNE-EN 60749-8:2004 | Identical |
| BS EN 60749-8:2003 | Identical |
| I.S. EN 62572-3:2016 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| BS EN 60749-14:2003 | Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity) |
| I.S. EN 60749-14:2003 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY) |
| BS EN 62572-3:2016 | Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication |
| CEI EN 60749-14 : 2004 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY) |
| EN 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
| EN 60749-14:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) |
| EN 60068-2-17:1994 | Environmental testing - Part 2: Tests - Test Q: Sealing |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
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