EN 62047-25:2016
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Published date
18-11-2016
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IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| CEI EN 62047-25 : 1ED 2017 | Identical |
| BS EN 62047-25:2016 | Equivalent |
| I.S. EN 62047-25:2016 | Equivalent |
| UNE-EN 62047-25:2016 | Identical |
| BS EN 62047-25:2016 | Identical |
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