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I.S. EN 60068-2-20:2008

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS

Available format(s)

Hardcopy , PDF

Superseded date

01-02-2022

Language(s)

English

Published date

01-01-2008

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test Ta: Solderability of wire and tag terminations
  4.1 Object and general description of the test
      4.1.1 Test methods
      4.1.2 Specimen preparation
      4.1.3 Initial measurements
      4.1.4 Accelerated ageing
  4.2 Method 1: Solder bath
      4.2.1 Description of the solder bath
      4.2.2 Flux
      4.2.3 Procedure
      4.2.4 Test conditions
      4.2.5 Final measurements and requirements
  4.3 Method 2: Soldering iron at 350 degrees C
      4.3.1 Description of soldering irons
      4.3.2 Solder and flux
      4.3.3 Procedure
      4.3.4 Final measurements and requirements
  4.4 Information to be given in the relevant specification
5 Test Tb: Resistance to soldering heat
  5.1 Object and general description of the test
      5.1.1 Test methods
      5.1.2 Initial measurements
  5.2 Method 1: Solder bath
      5.2.1 Description of the solder bath
      5.2.2 Flux
      5.2.3 Procedure
      5.2.4 Test conditions
      5.2.5 De-wetting
  5.3 Method 2: Soldering iron
      5.3.1 Description of soldering iron
      5.3.2 Solder and flux
      5.3.3 Procedure
  5.4 Recovery
  5.5 Final measurements and requirements
  5.6 De-wetting (if applicable)
  5.7 Information to be given in the relevant specification
Annex A (informative) Example of apparatus for accelerated
        steam ageing process
Annex B (normative) Specification for flux constituents
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

DevelopmentNote
Supersedes I.S. HD 323.2.20. (12/2008) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
30
PublisherName
National Standards Authority of Ireland
Status
Superseded
SupersededBy

Standards Relationship
EN 60068-2-20:2008 Identical
IEC 60068-2-20:2008 Identical

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 60068-2-78:2013 Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
EN 60068-2-66:1994 Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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