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IEC 60191-6-12:2002

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, Spanish, Castilian

Published date

14-06-2002

Superseded date

31-12-2021

Superseded by

IEC 60191-6-12:2011

$245.41
Including GST where applicable

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

DocumentType
Standard
Pages
20
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
CEI EN 60191-6-12 : 2002 Identical
BS EN 60191-6-12:2002 Identical
UNE-EN 60191-6-12:2011 Identical
UNE-EN 60191-6-12:2004 Identical

$245.41
Including GST where applicable