IEC 60191-6-18:2010/COR1:2010
Current
Current
The latest, up-to-date edition.
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Amendment of
Available format(s)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French
Published date
31-05-2010
Publisher
Free
Including GST where applicable
| Committee |
TC 47/SC 47D
|
| DocumentType |
Corrigendum
|
| Pages |
0
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 60191-6-18:2010 | Identical |
Summarise
Free
Including GST where applicable
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