IEC 60191-6-8:2001
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French, Spanish, Castilian
27-08-2001
FOREWORD
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Tables
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Also numbered as BS EN 60191-6-8 (11/2001) A Bilingual edition has been published. (01/2013) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
10
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN EN IEC 60191-6-8 : 2001 | Identical |
| PN EN 60191-6-8 : 2002 | Identical |
| NF EN 60191-6-8 : 2002 | Identical |
| DIN EN 60191-6-8:2002-05 | Identical |
| I.S. EN 60191-6-8:2002 | Identical |
| CEI EN 60191-6-8 : 2002 | Identical |
| EN 60191-6-8:2001 | Identical |
| UNE-EN 60191-6-8:2002 | Identical |
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