Customer Support: 131 242

  • Shopping Cart
    There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert
Celebrate World Standards Day. Save 10% with code WSD2026 until 31 Oct. Save now

IEC 60384-21:2011

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

09-12-2011

Superseded date

31-12-2021

$554.84
Including GST where applicable
Summarise this standard

FOREWORD
1 General
2 Preferred ratings and characteristics
3 Quality assessment procedures
4 Test and measurement procedures
Annex A (normative) - Guidance for the specification
        and coding of dimensions of fixed surface
        mount multilayer capacitors of ceramic dielectric,
        Class 1
Annex B (informative) - Combination of temperature
        coefficient and tolerance for the reference
        temperature of 25 degree C
Bibliography

IEC 60384-21:2011 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14. This second edition cancels and replaces the first edition published in 2004 and contains the following significant technical changes with respect to the previous edition:
- The test voltage of 1,2 UR at UR greater or equal to 1 000 V has been added in 4.5.4 Voltage proof.
- Detail test conditions have been added in 4.7 Shear test and 4.8 Substrate bending test.
- Test conditions applying lead free solder alloy (Sn-Ag-Cu) have been included in 4.9 Resistance to soldering heat and 4.10 Solderability.
- A selection of the test conditions according to marketing needs have been stated in 4.13 Damp heat, steady state.
- The dimensions of 0402 M in Annex A have been added.
- The code of the temperature coefficient and the tolerance of capacitance for the reference temperature of 25 °C have been added, see Annex B.

Committee
TC 40
DevelopmentNote
Together with IEC 60384-21-1, IEC 60384-22 & IEC 60384-22-1 supersedes IEC 60384-10 & IEC 60384-10-1. (06/2004) Stability Date: 2019. (10/2012)
DocumentType
Standard
Pages
80
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

⚠

A newer version of this standard is available.

View Current Edition View Current Edition
$554.84
Including GST where applicable