IEC 60455-3-11:1988
Current
The latest, up-to-date edition.
Specification for solventless polymerisable resinous compounds used for electrical insulation. Part 3: Specifications for individual materials. Sheet 11: Epoxy resin-based coating powders
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
15-04-1988
FOREWORD
PREFACE
INTRODUCTION
1. Scope
2. Designation
3. Requirements
TABLE 1 - General requirements for the coating after cure
Contains the general and special requirements for thermosetting epoxy resin-based coating powders.
| Committee |
TC 15
|
| DevelopmentNote |
Also numbered as BS 5664-3.11(1995) (08/2005) Stability Date: 2019. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
13
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| CEI 15-61 : 1997 | Identical |
| HD 307.3.11 : 200S1 | Identical |
| NFC 26 163-11 : 1993 | Identical |
| VDE 0355-311 : DRAFT 90 | Identical |
| UNE 21340-3-11:1993 | Identical |
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