IEC 60512-16-7:2008
Current
The latest, up-to-date edition.
Connectors for electronic equipment - Tests and measurements - Part 16-7: Mechanical tests on contacts and terminations - Test 16g: Measurement of contact deformation after crimping
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
21-07-2008
FOREWORD
1 Scope and object
2 Normative references
3 Preparations
4 Test procedure
5 Measurements and requirements
6 Details to be specified
Bibliography
IEC 60512-16-7:2008 details a standard test method to assess the effectiveness of contacts to resist deformation (damage) from crimping operations.
| Committee |
TC 48/SC 48B
|
| DevelopmentNote |
To be read in conjunction with IEC 60512-1 and IEC 60512-1-100. (07/2008) Supersedes IEC 60512-8. (05/2012) Stability Date: 2017. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
13
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| DIN EN 60512-16-7:2009-03 | Identical |
| NF EN 60512-16-7 : 2008 | Identical |
| NBN EN 60512-16-7 : 2010 | Identical |
| NEN EN IEC 60512-16-7 : 2008 | Identical |
| I.S. EN 60512-16-7:2008 | Identical |
| PN EN 60512-16-7 : 2008 | Identical |
| BS EN 60512-16-7:2008 | Identical |
| CEI EN 60512-16-7 : 2010 | Identical |
| EN 60512-16-7:2008 | Identical |
| JIS C 5402-16-7:2012 | Identical |
| UNE-EN 60512-16-7:2008 | Identical |
| IEC 60512-1-1:2002 | Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination |
| IEC 60352-2:2006+AMD1:2013 CSV | Solderless connections - Part 2: Crimped connections - Generalrequirements, test methods and practical guidance |
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