IEC 60512-6-2:2002
Current
The latest, up-to-date edition.
Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
21-02-2002
Foreword
1 General
2 Preparation of the specimen
3 Test method
4 Measurements
5 Details to be specified
Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.
| Committee |
TC 48/SC 48B
|
| DevelopmentNote |
Stability Date: 2017. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
9
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60512-6-2 : 2002 | Identical |
| NEN EN IEC 60512-6-2 : 2002 | Identical |
| I.S. EN 60512-6-2:2002 | Identical |
| PN EN 60512-6-2 : 2006 | Identical |
| BS EN 60512-6-2:2002 | Identical |
| CEI EN 60512-6-2 : 2003 | Identical |
| EN 60512-6-2:2002 | Identical |
| DIN EN 60512-6-2:2003-01 | Identical |
| JIS C 5402-6-2:2005 | Identical |
| UNE-EN 60512-6-2:2002 | Identical |
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