IEC 60749-27:2006+AMD1:2012 CSV
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
25-09-2012
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Equipment
5 MM current waveform requirements
6 Device specific evaluation considerations
7 Classification procedure
8 Failure criteria
9 Classification criteria
10 Summary
IEC 60749-27:2006+A1:2012 Establishes a standard procedure for testing and classifying semiconductor devices according to their susceptibility to damage or degradation by exposure to a defined machine model (MM) electrostatic discharge (ESD). It may be used as an alternative test method to the human body model ESD test method. The objective is to provide reliable, repeatable ESD test results so that accurate classifications can be performed. This test method is applicable to all semiconductor devices and is classified as destructive. This consolidated version consists of the second edition (2006) and its amendment 1 (2012). Therefore, no need to order amendment in addition to this publication.
| DevelopmentNote |
Supersedes IEC PAS 62180. (10/2003) Stability Date: 2017. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749-27 : 2006 AMD 1 2013 | Identical |
| NEN EN IEC 60749-27 : 2007 AMD 1 2012 | Identical |
| PN EN 60749-27 : 2008 AMD 1 2013 | Identical |
| BS EN 60749-27 : 2006 | Identical |
| DIN EN 60749-27:2013-04 | Identical |
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