IEC 61188-6-1:2021
Current
The latest, up-to-date edition.
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
23-02-2021
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-9443-7
|
| Pages |
63
|
| ProductNote |
THIS STANDARD IS ALSO REFERES TO IEC 61188-6-2, IPC SM 782, IPC SM 782A
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN IEC 61188-6-1:2021 | Identical |
| I.S. EN IEC 61188-6-1:2021 | Identical |
| EN IEC 61188-6-1:2021 | Identical |
| CEI EN IEC 61188-6-1:2021-11 | Identical |
| BS EN IEC 61188-6-1:2021 | Equivalent |
| UNE-EN IEC 61188-6-1:2021 | Identical |
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